Method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame

ABSTRACT

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of Ser. No. 13/845,168filed on Mar. 18, 2013, and entitled “WINDING-TYPE SOLID ELECTROLYTICCAPACITOR PACKAGE STRUCTURE USING A LEAD FRAME AND METHOD OFMANUFACTURING THE SAME”, now pending, the entire disclosures of whichare incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The instant disclosure relates to a method of manufacturing a solidelectrolytic capacitor package structure, and more particularly to amethod of manufacturing a winding-type solid electrolytic capacitorpackage structure using a lead frame.

2. Description of Related Art

The winding-type capacitor includes a capacitor core, a casing, and asealing cover. The capacitor core has an anode foil coupled to an anodeterminal, a cathode foil coupled to a cathode terminal, a separator, andan electrolyte layer. The anode foil, the cathode foil and the separatorare rolled together. The separator is disposed between the anode foiland the cathode foil. The electrolyte layer is formed between the anodefoil and the cathode foil. The casing has an opening for receiving thecapacitor core. The sealing cover can used to seal the casing, and theanode terminal and the cathode terminal can pass through a through holeof the sealing cover. A given space is provided between the sealingcover and the capacitor core. A stopper for securing the space isprovided on at least one of the anode terminal and the cathode terminal.However, there is no any other package body for enclosing thewinding-type capacitor in the prior art.

SUMMARY OF THE INVENTION

One aspect of the instant disclosure relates to a method ofmanufacturing a winding-type solid electrolytic capacitor packagestructure using a lead frame.

One of the embodiments of the instant disclosure provides a method ofmanufacturing a winding-type solid electrolytic capacitor packagestructure using a lead frame, comprising: providing a plurality ofwinding capacitors, wherein each winding capacitor has a winding body, apositive conductive lead pin extended from a first lateral side of thewinding body, a negative conductive lead pin extended from a secondlateral side of the winding body, a positive soldering foot soldered onan end of the positive conductive lead pin, and a negative solderingfoot soldered on an end of the negative conductive lead pin; pressingthe winding body of each winding capacitor from a cylinder into acuboid; removing the negative soldering foot of each winding capacitorby cutting; soldering the positive soldering foot of each windingcapacitor on a connection bar; processing the winding capacitors by acarbonization process, a formation process and a polymer-impregnatedprocess in sequence; removing polymer that has been formed on an endportion of the negative conductive lead pin of each winding capacitor;removing the positive soldering foot of each winding capacitor bycutting; respectively placing the winding capacitors on a plurality ofconductive units, wherein each conductive unit includes a positiveconductive terminal electrically connected to the positive conductivelead pin of the corresponding winding capacitor and a negativeconductive terminal electrically connected to the negative conductivelead pin of the corresponding winding capacitor; forming a plurality ofpackage bodies to respectively enclose the winding capacitors, whereinthe positive conductive terminal of each conductive unit has a firstembedded portion electrically connected to the positive conductive leadpin of the corresponding winding capacitor and enclosed by thecorresponding package body and a first exposed portion connected withthe first embedded portion and exposed outside the corresponding packagebody, and the negative conductive terminal of each conductive unit has asecond embedded portion electrically connected to the negativeconductive lead pin of the corresponding winding capacitor and enclosedby the corresponding package body and a second exposed portion connectedwith the second embedded portion and exposed outside the correspondingpackage body; and then bent the first exposed portion and the secondexposed portion of each conductive unit along an outer surface of thecorresponding package body.

More precisely, the positive conductive lead pin has a first flatteningsurface and a second flattening surface respectively formed on the topside and the bottom side thereof, the negative conductive lead pin has afirst flattening surface and a second flattening surface respectivelyformed on the top side and the bottom side thereof, and the secondflattening surface of the positive conductive lead pin and the secondflattening surface of the negative conductive lead pin are respectivelyabutted against the first embedded portion and the second embeddedportion, wherein the positive conductive lead pin has a cutting surfaceformed on an end thereof, and the negative conductive lead pin has agrinding surface formed on the end portion thereof by grinding orsandblasting.

More precisely, the winding body has a positive foil sheet, a negativefoil sheet and an isolation paper disposed between the positive foilsheet and the negative foil sheet, the positive foil sheet, the negativefoil sheet and the isolation paper are rolled to form a cuboid capacitorcore, and the positive conductive lead pin and the negative conductivelead pin respectively electrically contact the positive foil sheet andthe negative foil sheet.

More precisely, the positive conductive lead pin has a first positiveconductive portion inserted into the winding body and electricallycontacting the positive foil sheet and a second positive conductiveportion connected to the first positive conductive portion and extendedand exposed from the winding body, and the negative conductive lead pinhas a first negative conductive portion inserted into the winding bodyand electrically contacting the negative foil sheet and a secondnegative conductive portion connected to the first negative conductiveportion and extended and exposed from the winding body.

More precisely, both the length of the first positive conductive portionthat has been inserted into the winding body and the length of the firstnegative conductive portion that has been inserted into the winding bodyare the same as the width of the winding body.

More precisely, the method further comprises: heating the winding bodyof each winding capacitor at a temperature about 50° C.˜300° C. in thestep of pressing the winding body of each winding capacitor.

More precisely, the winding capacitors are respectively disposed on theconductive units by soldering or through solder paste or conductiveglue.

More precisely, the method further comprises: fixing the winding body ofeach winding capacitor through a clamping apparatus before the step ofremoving the polymer that has been formed on the end portion of thenegative conductive lead pin of each winding capacitor.

Therefore, because the polymer that has been formed on the end portionof the negative conductive lead pin of each winding capacitor can beremoved by grinding, scraping or sandblasting etc., the negativeconductive lead pin has a grinding surface (or scraping or sandblastingsurface) formed on the end portion of the negative conductive lead pinby grinding, scraping or sandblasting etc. for increasing the solderingyield rate and the equivalent series resistance (ESR).

To further understand the techniques, means and effects of the instantdisclosure applied for achieving the prescribed objectives, thefollowing detailed descriptions and appended drawings are herebyreferred, such that, through which, the purposes, features and aspectsof the instant disclosure can be thoroughly and concretely appreciated.However, the appended drawings are provided solely for reference andillustration, without any intention to limit the instant disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a flowchart of the method of manufacturing a winding-typesolid electrolytic capacitor package structure using a lead frameaccording to the instant disclosure;

FIG. 2 shows a lateral, schematic view of the winding capacitoraccording to the instant disclosure;

FIG. 3 shows a perspective, schematic view of pressing the winding bodyof the winding capacitor from a cylinder into a cuboid according to theinstant disclosure;

FIG. 4 shows a lateral, schematic view of soldering the positivesoldering foot of each winding capacitor on the connection bar accordingto the instant disclosure;

FIG. 5 shows a lateral, schematic view of removing the positivesoldering foot and the negative soldering foot of the winding capacitoraccording to the instant disclosure;

FIG. 6 shows a lateral, schematic view of placing the winding capacitoron the conductive unit according to the instant disclosure;

FIG. 7 shows a lateral, schematic view of enclosing the windingcapacitor by the package body according to the instant disclosure; and

FIG. 8 shows a lateral, schematic view of the winding-type solidelectrolytic capacitor package structure using a lead frame according tothe instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1 to FIG. 8, where FIG. 1 shows a flowchart of themethod of manufacturing a winding-type solid electrolytic capacitorpackage structure using a lead frame according to the instantdisclosure, FIG. 2 shows a lateral, schematic view of the windingcapacitor according to the instant disclosure, FIG. 3 shows aperspective, schematic view of pressing the winding body of the windingcapacitor from a cylinder into a cuboid according to the instantdisclosure, FIG. 4 shows a lateral, schematic view of soldering thepositive soldering foot of each winding capacitor on the connection baraccording to the instant disclosure, FIG. 5 shows a lateral, schematicview of removing the positive soldering foot and the negative solderingfoot of the winding capacitor according to the instant disclosure, FIG.6 shows a lateral, schematic view of placing the winding capacitor onthe conductive unit according to the instant disclosure, FIG. 7 shows alateral, schematic view of enclosing the winding capacitor by thepackage body according to the instant disclosure, and FIG. 8 shows alateral, schematic view of the winding-type solid electrolytic capacitorpackage structure using a lead frame according to the instantdisclosure. The instant disclosure provides a method of manufacturing awinding-type solid electrolytic capacitor package structure Z using alead frame, comprising the following steps:

First, referring to FIG. 1 and FIG. 2, the step S100 is that: providinga plurality of winding capacitors 20, wherein each winding capacitor 20has a winding body 200, a positive conductive lead pin 201 extended froma first lateral side of the winding body 200, a negative conductive leadpin 202 extended from a second lateral side of the winding body 200, apositive soldering foot 203 soldered on an end of the positiveconductive lead pin 201, and a negative soldering foot 204 soldered onan end of the negative conductive lead pin 202. More precisely, thepositive conductive lead pin 201 and the negative conductive lead pin202 are respectively extended from two opposite lateral sides of thewinding body 200. In addition, the positive soldering foot 203 can besoldered on the end of the positive conductive lead pin 201 through afirst soldering point 205, and the negative soldering foot 204 can besoldered on the end of the negative conductive lead pin 202 through asecond soldering point 206.

For example, both the positive conductive lead pin 201 and the negativeconductive lead pin 202 can be made of a pure Al (aluminum) material oran Al alloy material, the positive soldering foot 203 may be a firstmultilayer structure composed of a plurality of first material layers(not shown), and the negative soldering foot 204 may be a secondmultilayer structure composed of a plurality of second material layers(not shown). In addition, the innermost first material layer and theinner most second material layer are two Fe (ferrum) layers or two Cu(copper) layers, and the outermost first material layer and theoutermost second material layer are two Sn (Stannum) layers respectivelysurrounding the two Fe layers or the two Cu layers. However, theabove-mentioned design for the winding capacitors 20 is merely anexample and is not meant to limit the instant disclosure.

Next, referring to FIG. 1, FIG. 2 and FIG. 3, the step S102 is that:pressing the winding body 200 of each winding capacitor 20 from acylinder into a cuboid such as a rectangular prism. In other words, theshape of the winding body 200 can be changed from the cylinder into thecuboid by pressing. Hence, the winding body 200 of each windingcapacitor 20 has a plane top surface 2001 and a plane bottom surface2002 formed by pressing, and the plane top surface 2001 and the planebottom surface 2002 are opposite to each other. More precisely, themethod of the instant disclosure further comprises: heating the windingbody 200 of each winding capacitor 20 at a temperature about 50° C.˜300°C. in or before the step of pressing the winding body 200 of eachwinding capacitor 20.

For example, referring to FIG. 2 and FIG. 3, the winding body 200 has apositive foil sheet 200A, a negative foil sheet 200B and an isolationpaper 200C disposed between the positive foil sheet 200A and thenegative foil sheet 200C, and the positive foil sheet 200A, the negativefoil sheet 200B and the isolation paper 200C can be rolled and pressedto form a cuboid capacitor core. In addition, the positive conductivelead pin 201 and the negative conductive lead pin 202 can respectivelyelectrically contact the positive foil sheet 200A and the negative foilsheet 200B. Moreover, the positive conductive lead pin 201 has a firstpositive conductive portion 2011 inserted into the winding body 200 andelectrically contacting the positive foil sheet 200A and a secondpositive conductive portion 2012 integrally connected to the firstpositive conductive portion 2011 and extended and exposed from thewinding body 200. And, the negative conductive lead pin 202 has a firstnegative conductive portion 2021 inserted into the winding body 200 andelectrically contacting the negative foil sheet 200B and a secondnegative conductive portion 2022 integrally connected to the firstnegative conductive portion 2021 and extended and exposed from thewinding body 200. In addition, both the length (shown as the dotted linein FIG. 2) of the first positive conductive portion 2011 that has beeninserted into the winding body 200 and the length (shown as the dottedline in FIG. 2) of the first negative conductive portion 2021 that hasbeen inserted into the winding body 200 are substantially the same asthe width of the winding body 200. More precisely, the method ofmanufacturing the cuboid capacitor core further includes: rolling thepositive foil sheet 200A, the negative foil sheet 200B and the isolationpaper 200C to form a cylinder capacitor core (shown as the step (A) ofFIG. 3), and then pressing the cylinder capacitor core to form a cuboidcapacitor core (shown as the step (B) of FIG. 3) at a temperature about50° C.˜300° C.

Then, referring to FIG. 1, FIG. 2 and FIG. 4, the method of the instantdisclosure further comprises: removing the negative soldering foot 204of each winding capacitor 20 by cutting (the step S104) and removing thesecond soldering point 206 (as shown in FIG. 4, the negative conductivelead pin 202 is still remained on the winding body 200), soldering thepositive soldering foot 203 of each winding capacitor 20 on a connectionbar S (the step S106), and then processing the winding capacitors 20 bya carbonization process, a formation process and a polymer-impregnatedprocess in sequence (the step S108). In addition, both the carbonizationprocess and the formation process can be repeatedly proceeded forincreasing the production yield rate.

Afterward, referring to FIG. 1, FIG. 4 and FIG. 5, the method of theinstant disclosure further comprises: removing polymer that has beenformed on an end portion of the negative conductive lead pin 202 of eachwinding capacitor 20 (the step S110), and then removing the positivesoldering foot 203 of each winding capacitor 20 by cutting (the stepS112) and removing the first soldering point 205 (as shown in FIG. 5,the positive conductive lead pin 201 is still remained on the windingbody 200). More precisely, the method of the instant disclosure furthercomprises: fixing the winding body 200 of each winding capacitor 20through a clamping apparatus C (shown as the arrow in FIG. 4) before thestep of removing the polymer that has been formed on the end portion ofthe negative conductive lead pin 202 of each winding capacitor 20.Hence, the clamping apparatus C can be used to prevent the windingcapacitors 20 from being shaken or swayed, thus it is convenient toremove the polymer by using the clamping apparatus C. Furthermore, thepositive conductive lead pin 201 has a first flattening surface 20121and a second flattening surface 20122 respectively formed on the topside and the bottom side thereof, and the negative conductive lead pin202 has a first flattening surface 20221 and a second flattening surface20222 respectively formed on the top side and the bottom side thereof.In addition, because the positive soldering foot 203 and the firstsoldering point 205 of each winding capacitor 20 can be removed bycutting, the positive conductive lead pin 201 has a cutting surface20123 formed on an end of the positive conductive lead pin 201. And,because the polymer that has been formed on the end portion of thenegative conductive lead pin 202 of each winding capacitor 20 can beremoved by grinding, scraping or sandblasting etc., the negativeconductive lead pin 202 has a grinding surface 20223 (or scraping orsandblasting surface) formed on the end portion of the negativeconductive lead pin 202 by grinding, scraping or sandblasting etc. forincreasing the soldering yield rate and the equivalent series resistance(ESR).

Subsequently, referring to FIG. 1, FIG. 5 and FIG. 6, the step S114 isthat: respectively placing the winding capacitors 20 on a plurality ofconductive units 4 such as the lead frames, wherein each conductive unit4 includes a positive conductive terminal 41 (such as the positiveelectrode of the lead frame) electrically connected to the positiveconductive lead pin 201 of the corresponding winding capacitor 20 and anegative conductive terminal 42 (such as the negative electrode of thelead frame) electrically connected to the negative conductive lead pin202 of the corresponding winding capacitor 20. More precisely, thewinding capacitors 20 can be respectively disposed on the conductiveunits 4 by soldering or through solder paste or conductive glue etc.

Next, referring to FIG. 1, FIG. 6 and FIG. 7, the step S116 is that:forming a plurality of package bodies 30 to respectively enclose thewinding capacitors 20, wherein the positive conductive terminal 41 ofeach conductive unit 4 has a first embedded portion 411 electricallyconnected to the positive conductive lead pin 201 of the correspondingwinding capacitor 20 and enclosed by the corresponding package body 30and a first exposed portion 412 connected with the first embeddedportion 411 and exposed outside or from the corresponding package body30, and the negative conductive terminal 42 of each conductive unit 4has a second embedded portion 421 electrically connected to the negativeconductive lead pin 202 of the corresponding winding capacitor 20 andenclosed by the corresponding package body 30 and a second exposedportion 422 connected with the second embedded portion 421 and exposedoutside or from the corresponding package body 30. More precisely, thewinding capacitors can be processed by an ageing process after the stepS116 of forming the package bodies 30 to respectively enclose thewinding capacitors 20. Furthermore, each package body 30 has a firstlateral surface 301, a second lateral surface 302 opposite to the firstlateral surface 301, and a bottom surface 303 connected between thefirst lateral surface 301 and the second lateral surface 302. When thewinding capacitors 20 are respectively disposed on the conductive units4, the second flattening surface 20122 of the positive conductive leadpin 201 and the second flattening surface 20222 of the negativeconductive lead pin 202 can be respectively abutted against the firstembedded portion 411 and the second embedded portion 412.

Finally, referring to FIG. 1, FIG. 7 and FIG. 8, the step S118 is that:bent the first exposed portion 412 and the second exposed portion 422 ofeach conductive unit 4 along an outer surface of the correspondingpackage body 30. More precisely, the first exposed portion 412 can beextended along the first lateral surface 301 and the bottom surface 303of the package body 30, and the second exposed portion 422 can beextended along the second lateral surface 302 and the bottom surface 303of the package body 30.

In conclusion, the instant disclosure provides a method of manufacturinga winding-type solid electrolytic capacitor package structure using alead frame, comprising: providing a plurality of winding capacitors,wherein each winding capacitor has a winding body, a positive conductivelead pin, a negative conductive lead pin, a positive soldering foot anda negative soldering foot; pressing the winding body of each windingcapacitor from a cylinder into a cuboid; removing the negative solderingfoot of each winding capacitor by cutting; soldering the positivesoldering foot of each winding capacitor on a connection bar; processingthe winding capacitors by a carbonization process, a formation processand a polymer-impregnated process in sequence; removing polymer that hasbeen formed on an end portion of the negative conductive lead pin ofeach winding capacitor; removing the positive soldering foot of eachwinding capacitor by cutting; respectively placing the windingcapacitors on a plurality of conductive units, wherein each conductiveunit includes a positive conductive terminal and a negative conductiveterminal; forming a plurality of package bodies to respectively enclosethe winding capacitors, wherein the positive conductive terminal of eachconductive unit has a first embedded portion and a first exposedportion, and the negative conductive terminal of each conductive unithas a second embedded portion and a second exposed portion; and thenbent the first exposed portion and the second exposed portion of eachconductive unit along an outer surface of the corresponding packagebody.

Hence, the instant disclosure can provide a winding-type solidelectrolytic capacitor package structure Z using a lead frame throughthe step S100 to the step S118, comprising: a capacitor unit 2, apackage unit 3 and a conductive unit 4.

First, the capacitor unit 2 includes at least one winding capacitor 20,and the at least one winding capacitor 20 has a winding body 200, apositive conductive lead pin 201 extended from a first lateral side ofthe winding body 200, and a negative conductive lead pin 202 extendedfrom a second lateral side of the winding body 200. In addition, thepositive conductive lead pin 201 has a cutting surface 20123 formed onan end thereof by cutting process, and the negative conductive lead pin202 has a grinding surface 20223 formed on an end thereof by grindingprocess.

More precisely, the positive conductive lead pin 201 has a firstpositive conductive portion 2011 inserted into the winding body 200 andelectrically contacting the positive foil sheet 200A and a secondpositive conductive portion 2012 integrally connected to the firstpositive conductive portion 2011 and extended and exposed from thewinding body 200. In addition, the negative conductive lead pin 202 hasa first negative conductive portion 2021 inserted into the winding body200 and electrically contacting the negative foil sheet 200B and asecond negative conductive portion 2022 integrally connected to thefirst negative conductive portion 2021 and extended and exposed from thewinding body 200. For example, both the length of the first positiveconductive portion 2011 that has been inserted into the winding body 200and the length of the first negative conductive portion 2021 that hasbeen inserted into the winding body 200 are substantially the same asthe width of the winding body 200.

Moreover, the package unit 3 includes a package body 30 for enclosingthe at least one winding capacitor 20, and the package body 30 has afirst lateral surface 301, a second lateral surface 302 opposite to thefirst lateral surface 301, and a bottom surface 303 connected betweenthe first lateral surface 301 and the second lateral surface 302. Inaddition, the conductive unit 4 includes a positive conductive terminal41 electrically connected to the positive conductive lead pin 201 and anegative conductive terminal 42 electrically connected to the negativeconductive lead pin 202, and the positive conductive terminal 41 and thenegative conductive terminal 42 are separated from each other.

More precisely, the positive conductive terminal 41 has a first embeddedportion 411 electrically connected to the positive conductive lead pin201 and enclosed by the package body 30 and a first exposed portion 412connected with the first embedded portion 411 and exposed outside thepackage body 30, and the first exposed portion 412 can be extended alongthe first lateral surface 301 and the bottom surface 303 of the packagebody 30. In addition, the negative conductive terminal 42 has a secondembedded portion 421 electrically connected to the negative conductivelead pin 202 and enclosed by the package body 30 and a second exposedportion 422 connected with the second embedded portion 421 and exposedoutside the package body 30, and the second exposed portion 422 can beextended along the second lateral surface 302 and the bottom surface 303of the package body 30. For example, the positive conductive lead pin201 has a first flattening surface 20121 and a second flattening surface20122 respectively formed on the top side and the bottom side thereof,the negative conductive lead pin 202 has a first flattening surface20221 and a second flattening surface 20222 respectively formed on thetop side and the bottom side thereof, and the second flattening surface20122 of the positive conductive lead pin 201 and the second flatteningsurface 20222 of the negative conductive lead pin 202 can berespectively abutted against the first embedded portion 411 and thesecond embedded portion 421.

In conclusion, because the polymer that has been formed on the endportion of the negative conductive lead pin 202 of each windingcapacitor 20 can be removed by grinding, scraping or sandblasting etc.,the negative conductive lead pin 202 has a grinding surface 20223 (orscraping or sandblasting surface) formed on the end portion of thenegative conductive lead pin 202 by grinding, scraping or sandblastingetc. for increasing the soldering yield rate and the equivalent seriesresistance (ESR).

The above-mentioned descriptions merely represent the preferredembodiments of the instant disclosure, without any intention or abilityto limit the scope of the instant disclosure which is fully describedonly within the following claims. Various equivalent changes,alterations or modifications based on the claims of instant disclosureare all, consequently, viewed as being embraced by the scope of theinstant disclosure.

What is claimed is:
 1. A method of manufacturing a winding-type solidelectrolytic capacitor package structure using a lead frame, comprising:providing a plurality of winding capacitors, wherein each windingcapacitor has a winding body, a positive conductive lead pin extendedfrom a first lateral side of the winding body, a negative conductivelead pin extended from a second lateral side of the winding body, apositive soldering foot soldered on an end of the positive conductivelead pin, and a negative soldering foot soldered on an end of thenegative conductive lead pin; pressing the winding body of each windingcapacitor from a cylinder into a cuboid; removing the negative solderingfoot of each winding capacitor by cutting; soldering the positivesoldering foot of each winding capacitor on a connection bar; processingthe winding capacitors by a carbonization process, a formation processand a polymer-impregnated process in sequence; removing polymer that hasbeen formed on an end portion of the negative conductive lead pin ofeach winding capacitor; removing the positive soldering foot of eachwinding capacitor by cutting; respectively placing the windingcapacitors on a plurality of conductive units, wherein each conductiveunit includes a positive conductive terminal electrically connected tothe positive conductive lead pin of the corresponding winding capacitorand a negative conductive terminal electrically connected to thenegative conductive lead pin of the corresponding winding capacitor;forming a plurality of package bodies to respectively enclose thewinding capacitors, wherein the positive conductive terminal of eachconductive unit has a first embedded portion electrically contacting thepositive conductive lead pin of the corresponding winding capacitor andenclosed by the corresponding package body and a first exposed portionconnected with the first embedded portion and exposed outside thecorresponding package body, and the negative conductive terminal of eachconductive unit has a second embedded portion electrically contactingthe negative conductive lead pin of the corresponding winding capacitorand enclosed by the corresponding package body and a second exposedportion connected with the second embedded portion and exposed outsidethe corresponding package body; and bending the first exposed portionand the second exposed portion of each conductive unit along an outersurface of the corresponding package body.
 2. The method of claim 1,wherein the positive conductive lead pin has a first flattening surfaceand a second flattening surface respectively formed on the top side andthe bottom side thereof, the negative conductive lead pin has a firstflattening surface and a second flattening surface respectively formedon the top side and the bottom side thereof, and the second flatteningsurface of the positive conductive lead pin and the second flatteningsurface of the negative conductive lead pin are respectively abuttedagainst the first embedded portion and the second embedded portion,wherein the positive conductive lead pin has a cutting surface formed onan end thereof, and the negative conductive lead pin has a grindingsurface formed on the end portion thereof by grinding or sandblasting.3. The method of claim 1, wherein the winding body has a positive foilsheet, a negative foil sheet and an isolation paper disposed between thepositive foil sheet and the negative foil sheet, the positive foilsheet, the negative foil sheet and the isolation paper are rolled toform a cuboid capacitor core, and the positive conductive lead pin andthe negative conductive lead pin respectively electrically contact thepositive foil sheet and the negative foil sheet.
 4. The method of claim3, wherein the positive conductive lead pin has a first positiveconductive portion inserted into the winding body and electricallycontacting the positive foil sheet and a second positive conductiveportion connected to the first positive conductive portion and extendedand exposed from the winding body, and the negative conductive lead pinhas a first negative conductive portion inserted into the winding bodyand electrically contacting the negative foil sheet and a secondnegative conductive portion connected to the first negative conductiveportion and extended and exposed from the winding body.
 5. The method ofclaim 4, wherein both the length of the first positive conductiveportion that has been inserted into the winding body and the length ofthe first negative conductive portion that has been inserted into thewinding body are the same as the width of the winding body.
 6. Themethod of claim 1, further comprising: heating the winding body of eachwinding capacitor at a temperature about 50° C.˜300° C. in the step ofpressing the winding body of each winding capacitor.
 7. The method ofclaim 1, wherein the winding capacitors are respectively disposed on theconductive units by soldering or through solder paste or conductiveglue.
 8. The method of claim 1, further comprising: fixing the windingbody of each winding capacitor through a clamping apparatus before thestep of removing the polymer that has been formed on the end portion ofthe negative conductive lead pin of each winding capacitor.